Product Selector

401K08 is a premixed blue LTCC dielectric powder and designed for tape application such as CT800 tape or other LTCC ceramic substrates which allow the production of multilayer circuits.
401K08 is compatible with Heraeus binder system TOP7750 and other binder systems typically used in tape fabrication. In tape form this material is also compatible with Heraeus silver, gold conductor and resistor systems.

51528 B is a premixed lead free and dark blue LTCC dielectric powder and designed for tape applications such as LTCC and passive component manufacture.

51555 W is a premixed lead free and white LTCC dielectric powder and designed for tape applications such as LTCC and passive component manufacture.

51559 BL is a premixed lead free and black LTCC dielectric powder and designed for tape applications such as LTCC and passive component manufacture.

51K65 is a premixed lead free and gray LTCC dielectric powder (K ~ 64) and designed for tape applications such as LTCC and passive component manufacture.

Ag 300-01 is a chemically precipitated spherical silver powder with a high purity (> 99,9%).

These powders exhibit a tight particle size distribution and excellent dispersion properties.

Ag 300-02 is a chemically precipitated silver powder with a high purity (> 99.9%).

These powders exhibit a wider particle size distribution and a high surface area.

The air dry silvers are used to make non-conductive surfaces electrically and thermally conductive. They can be used in circuit repair or as RF shielding materials. Most can be brushed, sprayed or dipped. These materials will cure at room temperature in 16-20 hours or in 30 minutes at 120-200 degree C. A heat gun will cure the material in seconds. The conductivity of the film can be increased by repeated application of layers.

Au 200-03 is a chemically precipitated spherical Gold powder with a high purity (> 99.9%).

Au 200-09 is a chemically precipitated gold flake powder with a high purity (> 99.9%).

low cost pure Ag conductor. It has good solderability and very high conductivity. This product is used as the termination for the R 8900 series resistor. It is suitable for RF transmission. Cd and Ni free.

Ag/Pt low cost solderable conductor that is heavy Al wire bondable. It has high conductivity and is Cd and Ni free. This product is used as a termination for the R 8900 series resistors. Metallizes laser drilled through holes in alumina.

Ag hole plug for alumina substrates.The high solids loading and low shrinkage allows for excellent filling properties with bladder fill machines.

C 2028 is a screen printable 2.8 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2030 is a screen printable 3.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2040 is a screen printable 4.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2060 is a screen printable 6.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

High performance, lead, cadmium and nickel free mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion.

Lead, cadmium and nickel free Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminum wire bondable.

Lead, cadmium and nickel free Pd/Ag composition designed for applications where more leach resistance is required. The C2140 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminum wire bondable.

lead, cadmium and nickel free Pd/Ag composition designed for hybrid applications and application where more leach resistance is required. The C2160 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial applications where more stringent requirement exist. It exhibits excellent solderability and aged adhesion properties.

lead, cadmium and nickel free Pd/Ag composition designed for automotive applications, with similar electrical and mechanical performance to 6:1 Ag/Pd conductors. The C 2180 conductor is suitable for a wide variety of applications where low cost and excellent performance are required. It exhibits excellent solderability and aged adhesion properties.

This conductor provides outstanding leach resistance and aged adhesion with many types of solder. It has excellent silver migration resistance. It's exceptional coverage makes it cost effective to use.

C 4301 GSD is a AgPd (0.8:1) conductor paste which exhibits a high density, high reliability and good fine line resolution.

Ag/Pd conductor for use in fuel sender cards. Resistant to "harsh" fuels and withstands constant wiping. Very high print definition.

C4303M is a low cost paste for fuel senders and is a 2.33/1 Ag/Pd version of C 4303 GSD. This conductor exhibits highdensity, high reliability and good fine line definition, (5mil lines and spaces). It is mechanically durable and chemically resistant. Conductivity, leach resistance, and resistance to silver migration are exceptional. It is frequently a preferred material for fuel sensor applications, particularly in automobiles. C 4303 M fires to a very smooth, dense chemically resistant conductor. The material prints thin about - 11microns FFT.

C 4727 (H) is a lead, nickel and cadmium free 99:1 silver – platinum conductor, designed for low cost applications.

lead, nickel and cadmium free Ag/Pt conductor, designed for automotive applications. C4729 is a member of Heraeus' line of lead free conductors with excellent fired film density, high conductivity, good solder leach resistance and excellent aged adhesion.

C 5007 is a wire bondable cadmium-free gold conductor, containing a mixed bonded Au formulation.

It offers excellent aged wire bond adhesion and contact resistivity properties. It is compatible with the recrystallizable dielectric, IP 9117 series, and has been formulated to be resistant to blistering after multiple firings, also when fired together and "on top" of the Heraeus C 2000 nickel-free range of Ag / Pd conductors.

C 5203 is a high-reliability, general-purpose Au / Pd fritted conductor paste, suitable for a variety of applications, and compatible with most resistor systems. It exhibits good leaching properties with tin – lead solders, as well as a good aged adhesion. C 5203 is cadmium free.

Typical applications are those where silver – bearing cannot be used, due to the risk of Ag migration. This Au / Pd conductor can represent a suitable replacement for Au / Pt pure Au, where high conductivity is not the prime requirement.

cadmium and lead free gold conductor paste, that has been formulated for use with Au wire bond applications.

High speed auto Au bondable conductor with high density based upon Heraeus' "KQ" powder technology. Ultra high conductivity and print definition to 75 microns. It is specifically designed for Au wire bonding and is capable of resolving 75 micron lines and spaces. C 5755 A is suitable for RF transmission and for "bright fingers" in commercial application. It is Cd free.

high speed auto Au and Al high density conductor based upon Heraeus' "KQ" powder technology. Very high conductivity and print definition to 75 microns. It is specially designed for Au and Al (1.25-25mils) wire bonding and is capable of resolving 75 micron lines and spaces. C 5756 is suitable for "bright fingers" in commercial applications. Can be heavy Al bonded. It is Cd free.

Au via fill for multilayer structures in IP 9117 S / D dielectric.

Au paste designed as plug hole material for stencil printing, Cd-free.

Au paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties with bladder fill machines. C 5909 has low shrinkage, which allows for a complete fill of the through hole.

Au/Pd/Pt conductor paste for fuel sensor applications. It does not contain Ag, Cd or Ni. C 6011 is optimized in hardness and surface density. It exhibits excellent mechanical resistance after firing.

solderable Au/Pd/Pt conductor paste for fuel sensor applications. It is solderable with customary solder alloys. It does not contain Ag, Cd or Ni. C 6012 is optimized in hardness and surface density. It shows excellent printability resulting in high line definition and smooth surface under various drying conditions. It exhibits very good mechanical resistance after firing.

900°C firing copper conductor which eliminates silver migration and solder leaching. High conductivity makes it ideal for high power applications.

Screen printable, pure silver paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties. C8709P has low shrinkage, which allows for a complete fill of the through hole.

An unfritted conductor designed for thick print applications. It exhibits excellent solderability and low resistivity.

C 8717 B is a lead, nickel and cadmium free Ag conductor that yields a smooth, dense film on alumina. This material is recommended for power hybrid applications where high current is a requirement and for large ground plane areas. To achieve needed thickness the paste can be printed in stacked layers up to 300µm.

The paste provides excellent bond adhesion, solderability and good solder leach resistance.

lead, nickel and cadmium free Ag conductor that yields a smooth, dense film on alumina. This material is recommended for general purpose and for large ground plane areas. C8728 provides excellent solderability, void free soldering and good solder leach resistance.

lead, nickel and cadmium free plateable silver conductor that yields a smooth, dense film. It exhibits high adhesion. C8729 can be multiple fired without any loss of performance. C 8729 is an excellent choice for plating applications, such as copper, nickel, etc.

low temperature silver conductor, Pb- and Cd-free.

C 2210 is a 0.8:1 Ag/Pd pre-alloyed conductor paste which exhibits a high density, high reliability and remarkable fine line resolution. C 2210 has an enriched Pd content to address increased demands by low sulfur fuel applications.

It is a member of the lead free C22xx - series.

C2220 is a 2.1:1 Ag/Pd conductor paste which exhibits a high density, high reliability and good fine line resolution. The surface of the fired material is very smooth.

It is a member of the lead free C22xx - series.

C2230 is a 3:1 Ag/Pd conductor paste which exhibits a high density, high reliability and good fine line resolution. The surface of the fired material is very smooth.

It is a member of the lead free C22xx - series.

C2240 is a 4:1 Ag/Pd conductor paste which exhibits a high density, high reliability and good fine line resolution. The surface of the fired material is very smooth.

It is a member of the lead free C22xx - series.

Fritless platinum conductor paste that fires to a pure metal surface. Suitable for screenprinting. Cd- & Pb-free.

Fritless platinum conductor paste that fires to a pure metal surface. Suitable for brushing and dipping. Cd- & Pb-free.

CL11-7840 is ceramic filled to reduce shrinkage and fills cavities.

Cadmium and lead free gold conductor paste, that has been formulated to print thin and to have good Au wire bond adhesion.

Heraeus low temperature co-fireable tape is designed to allow production of high performance wireless and multilayer circuits.

Smooth and dense surface which enables for further thin film processing steps.

Smooth and dense surface which enables for further thin film processing steps.

Ag disc termination for low voltage varistors. It fires @ 650°C and has excellent solderability with non-activated fluxes.

Ag termination material designed for use on NTC Thermistors. Exhibits high adhesion with both low and high temperature solders and gives excellent resistance stability after solder and lead attachment. It fires at 700°C.

600°C fireable Ag conductor developed as a disc termination for lead zirconate titanate (PZT) ceramic materials. It is manufactured at a viscosity optimized for applications by screen printing. It is available for sprayable / dippable (DT 1402 S / DT1402 D) applications.

2-part cofireable termination system for barium titanate based PTC thermistor discs. The materials are cofired at 580-620°C. DT 1410 forms a non-solderable ohmic contact on the ceramic thermistor disc when used alone. C 4400 UF forms the solderable top layer.

Ag disc termination for line voltage varistos. It fires @ 850°C and exhibits excellent electrical characteristics including pulse stability and end of life stability.

Pb- and Cd-free solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and leach resistance.

Pb-free solderable Ag/Pt end termination designed for use on NPO MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion. ET1812 is supplied at a viscosity suitable for machine dip and blot or no-blot applications.

Pb- and Cd-free nickel plateable silver end termination designed to be compatible on a variety of ceramic bodies, including ferrites and multilayer ceramic chip capacitors. Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface. The rheology of ET1833B is suitable for machine dipping.

Pb- and Cd-free silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. It is supplied at a rheology suitable for machine dip application.

Pb- and Cd-free nickel plateable silver end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface.

CL82-8520, CL82-8520A, CL82-8520B, CL82-8520C are anode pastes for fuel cells. CL86-8706, CL86-8706A, CL86-8706B, CL86-8706C are cathode pastes for fuel cells. CL90-8705 is an electrolyte paste for fuel cells.

The liquid resinate GG Q3-15 % is a liquid precious metal product for use on quartz glass.

The material is suitable for heat reflective layers on quartz glass.

The material is suitable for heat reflective layers on quartz glass.

Heraeus' low temperature co-fireable tape is designed to offer an alternative to producing complex multilayer circuits using gold or silver conductors.

Lead free Heraeus' low temperature co-fireable tape is designed to offer an alternative to producing complex multilayer circuits using gold or silver conductors.

Lead free Heraeus' low temperature co-fireable tape is designed to offer an alternative to producing complex multilayer circuits using gold or silver conductors.

Lead free Heraeus' low temperature co-fireable tape is designed to offer an alternative to producing complex multilayer circuits using gold or silver conductors.

Heratape CT800 also works fine in the constrained/zero shrink sinter process.

Heraeus patent-pending technology enables near zero x/y shrinkage of LTCC tapes. HL 2000 is the first HeraLock enabled LTCC tape. For more information please look to HL2000 Design Guidelines.

Heraeus patent-pending technology enables near zero x/y shrinkage of LTCC tapes. HL800 is another HeraLock enabled LTCC tape. Fast firing cycles (total < 6 hours) are possible with HL800.

HL800 has properties appropriate for applications such as general-purpose packaging, automotive modules and RF applications requiring low-loss at high frequencies.

This Schematic contains information about:

screen printable, thixotropic paste, used for the build up of insulating layers for circuit crossovers and multilayer circuits. It is available in white and green.

IP 211 is a high temperature overglaze for protection of Platinum structures, e.g. sensor applications.

A clear version is available on demand.

It also can be used to cover Cr-steel with an insulating layer.

this resistor overglaze is screen-printable and fires to a glossy, green color, for optimum laser-trim charactericstics. it is fully compatible with R8900/E/E/ED/T resistor series, and enhances the stability of such resistors.

acid resistant overglaze with green color for optimum laser trim characteristics that fires at ~600°C. It was developed for chip resistor applications where Ni and Pb/Sn acid bath solutions are used. Is specifically designed to withstand attack during the plating process.

lead, cadmium and nickel free green overglaze designed for printing and firing over thick film resistors. IP 9035 A provides improved trimmed resistor stability and environmental protection. It has excellent process insensitivity and is compatible with all Heraeus air-fireable resistor series.

lead, nickel and cadmium free acid-resistant overglaze with green color for optimum laser trim characteristics. IP 9036 A was developed for large area printing and chip resistor applications where acid bath solutions are used. It is compatible with C 8728, C 8729 and other Heraeus conductors and the R 8900 series resistors.

black passivation glass which fires at 610°C to a smooth, pinhole-free film. Resistant to plating solutions, it was designed to be processed over IP 9029 to seal laser trim kerfs.

acid resistant white marking ink. It can be co-fired or post fired onto IP 9039 (black passivation glass). When co-fired with IP 9039, a smooth top surface will result, allowing for excellent handling by automated pick and place equipment. It has excellent print characteristics for number differentiation and fires at 610°C.

hermetic multilayer dielectric that can be used in mixed metallurgy applications. This dielectric supports solderable/bondable conductors and provides high stability for the R 8900 D resistors.

hermetic multilayer dielectric that can be used in mixed metallurgy applications. This dielectric supports solderable/bondable conductors and provides high stability for the R 8900 D resistors.
IP9117E is stabilized in shelf life.

permanent-blue 850°C firing dielectric composition. It withstands harsh conditions such as thermal shock cycling and hot temperature applications to meet requirements of automotive industry. It is Pb-, Cd- and Phtalate-free. Please see the application note for more details.

cadmium free, gold conductor paste developed for producing ultra-high density interconnections using a combination of screen printing and etching. This material uses the very latest developments in sub-micron gold powder technology in combination with a special printing vehicle to produce extremely dense fired films with very smooth fired finishes. These properties enable the production of conductor geometries as fine as 10 microns (0.4 mils).

silver conductor paste developed for producing ultra-high density interconnections using a combination of screen-printing and etching. This material will produce extremely dense fired films with very smooth fired finishes. These properties enable the production of conductor geometry's of 50 microns (2 mils), or better.

fritted platinum ink which fires to a catalytic, conductive and stable metallization. Excellent adhesion to zirconia and titania bodies, at a firing temperature of 850-960 °C.

fritted platinum conductor paste. Continous operation at high temperatures (up to 1000 °C) is possible.

It also works as a cofiring paste in LTCC tape.

Pd 600-03 is a chemically precipitated Palladium powder with a high purity (> 99.9%).

Pt 100-10 is a chemically precipitated Platinum powder with a high purity (> 99.9%).

A low range, lead free, low TCR air-fired resistor system, compatible with lead free Pt/Ag and Pd/Ag conductors. This series gives a dense fired film and was designed to give very tight resistance distribution when cofiring the front and back side of circuits. The series exhibits excellent print resolution for use in typical serpentine layouts. R 400 A Series is laser trimmable and has outstanding power handling capability.

A low range, low TCR air-fired resistor system, compatible with Pt/Ag and Pd/Ag conductors. This series gives a dense fired film and was designed to give very tight resistance distribution when cofiring the front and back side of circuits. The series exhibits excellent print resolution for use in typical serpentine layouts. Heraeus' R400H Series is laser trimmable, has outstanding power handling capability and pulse stability.

Heraeus R 400 H (D) Series is a low range, low TCR air-fired resistor system, compatible with Pt/Ag and Pd/Ag conductors. This series gives a dense fired film and was designed to give very tight resistance distribution when cofiring the front and back side of circuits. The series exhibits excellent print resolution for use in typical serpentine layouts.

Heraeus R 400 H (D) Series is laser trimmable, has outstanding power handling capability and pulse stability.

Heraeus R 400 L Series is a low range, low TCR air- fired resistor system with a low Pd content. This series is compatible with Pt/Ag and Pd/Ag conductors. It gives a dense fired film and was designed to give a very tight resistance distribution when cofiring the front and back side of circuits.

1 ohm to 1 Mohm/square, TCR < 100 ppm series for alumina and dielectric. Available in 60 minute and 30 minute firing versions. Termination specific calibrations available on Au, Pt/Ag, Ag/Pd and Ag conductors.

1 ohm to 1 Mohm/square, TCR < 100 ppm series for alumina and dielectric. Available in 60 minute and 30 minute firing versions. Termination specific calibrations available on Au, Pt/Ag, Ag/Pd and Ag conductors.

RP 070107-15% is a thin film conductor paste for use on alumina and glazed alumina.

RP10001/145B-12.5% is a thin film conductor paste for use on alumina and glazed alumina.

RP 10003-12.5% is a thin film conductor paste for use on alumina and glazed alumina.

Pt resinate paste offers to archieve a high HTCR of approximately 3850 ppm/K.

RuO2 703-04 is a chemically precipitated powder with a high purity (> 99.9%).

850°C firing glaze for insulation Cr-steel.

850°C firing glaze for insulating Cr-steel with no bowing during the wet stack process and excellent green strength. Co-firing of insulation, heater termination and coverglaze, in one step, is possible.

600-650°C firing, hermetic selaing glass designed to seal alumina to alumina.

620-700°C firing sealing glass designed to seal alumina to alumina. It has been engineered for low shrinkage during sealing.

TC 7101 is a pure Au via fill which provides excellent compatibility with Heratape CT 700 during the cofiring process. TC 7101 is optimized for screen printing or stencil printing of vias.

TC 7102 is a pure Au conductor which provides excellent compatibility with Heratape CT 700 during the cofiring process.

The material may be used to print fine line patterns and can be used as an inner layer as well as a top layer.

TC 7102 can be bonded with Al- and with Au-wire.

TC 7103 is a pure Au conductor which provides excellent compatibility with Heratape CT 700, CT 800 during the cofiring process. TC 7103 is optimized for screen printing of conductor tracks as well as large ground planes.

TC 7104 is a fritless, silver containing gold conductor material. It provides excellent bonding properties for heavy gold wire.

Because of it’s high solid content high fired thickness can be achieved.

TC 7104 was specifically developed for use as a top conductor on Heratape CT 700, CT 707 and CT 800. It exhibits a particularly good adhesion when fired upon these glass-based substrates.

TC 7301 is a pure Ag via fill which provides excellent compatibility with Heratape during the cofiring process.

TC 7301 is optimized for stencil printing of vias.

The paste is compatible with other cofiring pasts and with various postfiring pastes.

TC 7302 is a pure Ag conductor with high solid content. It provides excellent compatibility with Heratape

CT 700 and CT 800 during the cofiring process.

TC 7302 is optimized for screen printing of conductor tracks.

The material may readily be used to print fine line patterns.

After firing, the paste can easily be soldered.

TC 7303 is a pure Ag conductor with low solid content. It provides excellent compatibility with Heratape

CT 700 and CT 800 during the cofiring process.

TC 7303 is optimized for screen printing of conductor tracks.

The material may readily be used to print fine line patterns.

After firing, the paste can easily be soldered.

TC7304A is a pure Ag via fill which provides excellent compatibility with Heratape CT800 and CT70x during cofiring process.

TC7304A is optimized for stencil printing of vias.

The paste is compatible with other cofiring pastes and with various postfiring pastes.

TC 7306 A is a pure Ag paste developed for plateable top conductor applications.

It provides excellent compatibility with various kinds HERATAPE during the cofiring process.

TC 7306 A is optimized for screen printing of conductor tracks.

The material may readily be used to print fine line patterns.

After firing, the paste can be electroless plated.

TC 7402 is a Ag / Pd (ratio Ag:Pd = 6:1) conductor which provides excellent compatibility with Heratape CT 700 during the cofiring process.

TC 7402 is optimized for screen printing of conductor tracks.

The material may readily be used to print fine line patterns as top layers.

After firing the paste can easily be soldered.

TC 7403 is a Ag / Pd via fill (ratio Ag:Pd = 27:1) conductor which provides excellent compatibility with Heratape CT 700 during the cofiring process.

TC 7403 is optimized for stencil printing of vias.

The paste is compatible with other cofiring pastes and with various postfiring pastes.

TC 7404 is a fritted conductor material, with a silver / palladium ratio of 6:1. It is ideal for use as a resistor termination, and exhibits excellent bonding properties with heavy aluminum wire.

TC 7404 was specifically developed for use as a conductor on Heratape CT 700, CT 707 and CT 800. It exhibits a particularly good adhesion when fired upon these glass-based substrates.

TC7406 is a AgPd via-fill (ratio Ag:Pd = 13:1) conductor which provides excellent compatibility with Heratape CT700 during the co-firing process.

TC 7601 is a Ag / Pt conductor which provides excellent compatibility with Heratape CT 800 during the cofiring process.

TC 7601 is optimized for top layer screen printing of conductor tracks.

TC8101 is a pure Au conductor, which provides excellent compatibility with Heratape Clad CT800 and HL2000 during co-firing process.

TC8401 is a fritted AgPd conductor 6:1, which exhibits excellent bonding properties for heavy aluminium wire.

The paste was developed for use as a co-firing conductor on Clad Heratape CT800.

TO2001 is a screen printable dielectric that can be co-fired with CT2000 to act as a solder mask.

TO 7003 is an hermetic dense firing overglaze, particularly developed for use as a protection on resistors on fired substrates made of Heratape CT 700 and CT 800.

Because of the transparent green color adjustment of laser equipment is quick and easy. Resistors can be detected by automatic edge sensing systems.

Drift of Heraeus resistors is remarkably low and is with most of the decades negative when firing this overglaze on top. Therefore it can be easily compensated by laser trimming.

Resistors protected with TO 7003 show excellent long term stability after trimming because of absence of micro cracks.

TO 7003 can also be used as an protective glaze for most of the conductor pastes.

This is a UV curable solder mask/covercoat/dielectric designed for rigid substrates. UVD 5271 offers rapid curing combined with outstanding adhesion and resistance to solvents, moisture, and the soldering process. It is less sensitive to surface cleanliness than other UV curable materials. UVD 5271 has excellent electrical and environmental integrity after soldering and cleaning and outstanding fine line definition, typically 0.008 mils. Heraeus also offers a series of compatible, thermally cured conductors.

An organic mixture used for dispersing fine metal or oxide powders to make a screen printable paste. Used with a thinner such as RV-372 or a higher viscosity vehicle such as V-015, a paste can be made that can be applied by screen printing, dipping or other methods at various solids loadings.

V1765E is a premixed blue LTCC powder designed for tape application such as CT800 tape or other LTCC ceramic substrates which allow the production of multilayer circuits.

V1765E is compatible with Heraeus binder system TOP7750. Heraeus offers a complete system of compatible pastes for LTCC tapes.

X200W is a white LTCC powder.