Resinate Pastes
Resinate pastes are metallo-organic pastes. The pastes consist of metallo-organic compounds, which are dissolved in ethereal (organic) oils. Small quantities of base-metallo-organic compounds can be added as a bonding agent. Resin solutions are added to adjust the working properties. Following the application and firing of the paste, metallic layers are obtained. These layers can be electrically conductive or non-conductive, depending on their respective composition. The achieved layer thicknesses ranges from 0.1 µm to 0.6 µm after firing. These films can be finely structured by means of etching or screen printing.
Gold Resinate Pastes:
Gold-based resinate pastes are the most commonly used resinate pastes. They are available in a wide range, with varying metal contents and rheological properties. Gold contents are range from 12.5% to 22%.
Platinum Resinate Pastes:
Platinum resinate pastes are available with platinum contents of 12.5% and 15%. Two pastes with 12.5% Pt differ only in the content of bonding agents. On account of it’s high temperature coefficient of resistance (>3850 ppm/K), the version without bonding agent is especially suitable for the production of temperature sensors.
Silver Resinate Pastes:
Silver resinate pastes are available with a content of 20% and 25% silver. They can be used for printing conductor lines on alumina.
